hey i jsut picked this up from the intel website:
Micro-BGA2 Package
The BGA2 package consists of a die placed face-down on an organic substrate. An epoxy material surrounds the die, forming a smooth, relatively clear fillet. Instead of using pins, the packages use small balls, which acts as contacts for the processor. The advantage of using balls instead of pins is that there are no leads that bend. The PentiumŪ III processor uses the BGA2 package, which contains 495 balls.
Micro-PGA2 Package
The micro-PGA2 consists of a BGA package mounted to an interposer with small pins. The pins are 1.25 mm long and 0.30 mm in diameter. While there are several micro-PGA2 socket designs available, all of them are designed to allow zero-insertion force removal and insertion of the mobile Pentium III processor.
does this mean that BGA2 and PGA2 are interchangeable?
i ran the CPUID program and it came back with "package type: micro-pga/bga2"
what does that mean? micro pga? bga2? both? same different?
-JD