I like to put the cpu on the motherboard..then put the motherboard in the case etc..then put the heatsink on last.
you dont need much thermal compound....just one small "dot"...and dont try to spread it around...when you put the heatsink on the pressure will spread it around.....
usually you use a flat blade screwdriver to get a little pressure on the mounting tabs...but dont overdo it...and dont let the screwdriver slip and poke a whole in the board!
it is possible to get a heatsink on backwards..but if you look at the shape of the socket on the board it makes it easier....watch the "heatsink installation" video and notice what they say about the "step" on the bottom of the heatsink...that is how you see if its backwards...the step matches the "overhang" on the socket...
some nice videos here..showing how its done....
http://www.amd.com/us-en/Processors/...5E6678,00.html (ignore it when they recommend a thermal pad over thermal paste, lol)
And give it a close look over before you boot....if u get the heatsink on there all cockeyed..to where it isnt even flush on the cpu....the cpu will have a short but eventful life (a second or two?)
JP
now if you want to be highly scientific about it....you can check out Arctic Silver's website for their in depth instructions on thermal compund
http://www.arcticsilver.com/arctic_s...structions.htm
I break half those rules and there is conflicting advice on different sites....I personally have never tried to 'spread' any compound....I usually put a small "dot" or "mound" on the center of the cpu..then I put the heatsink on it and the heatsink pressure spreads it fine and dandy.....now on things like older celerons where the core of the cpu is much bigger there might be some spreading needed